Our high-performance Plunger Valve, also referred to as piston dispensing valve, stands as the optimal volumetric dispensing solution for low-fluidity and high-viscosity adhesives, sealants, potting compounds and thermal conductive gap fillers. It reliably processes materials loaded with fillers or abrasive grinding media, alongside single-component glues and two-component AB epoxy casting resins without clogging or inconsistent dosing.
This versatile plunger dispensing equipment covers a full spectrum of industrial workflows including vacuum potting filling, FIPG formed-in-place sealing, structural adhesive bonding, and conformal coating of thermal conductive paste for EV electronics and power assemblies. Operating on core volumetric dispensing principles, its dispense volume is precisely defined by the cylinder geometry and piston stroke length.
A standout advantage of the plunger metering system is its temperature, feed pressure and viscosity-independent mixing ratio. When handling two-component adhesive media, the fixed mechanical cylinder structure locks in consistent proportioning, unaffected by fluctuating material conditions. Dual cylinders synchronously extrude resin and hardener into dynamic mixing heads, delivering ultra-stable mixing ratios ranging from 1:1 up to 10:1.
Seamlessly compatible with self-leveling adhesive supply systems, vacuum pressure plate pump feeding stations and bubble-free feeding equipment, this plunger valve integrates smoothly with in-line vacuum potting machines, multi-layer curing ovens and flat wire motor stator dripping coating lines. It is widely deployed for PCB encapsulation, ECU & BMS potting, power semiconductor encapsulation, battery pack sealing and winding end potting in new energy vehicle and automotive electronics mass manufacturing.