AI Modules & IGBT Semiconductors - Hols(Suzhou) Automation Co.,Ltd.

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AI Modules & IGBT Semiconductors

AI Modules & IGBT Semiconductors

Home SOLUTIONS AI Modules & IGBT Semiconductors

Home SOLUTIONS AI Modules & IGBT Semiconductors

Automotive Optical Communication Module R&D Pilot Assembly Line

Automotive optical transceiver pilot line: precision assembly, dispensing & curing, optical calibration, electrical & environmental test, data traceability, closed-loop for prototype & low-volume validation.
Automotive Silicon Carbide (SiC) Module Automatic Assembly Line

Automotive SiC module automated line: die attach, sintering & welding, wire bonding, encapsulation, thermal/electrical test, EOL calibration & laser marking for high-precision, reliable mass production.
IGBT Gluing Assembly Line

IGBT module fully automatic gluing line, including functions such as curing, dust removal, height measurement, gluing, hardness testing, and capping.
IGBT Frame Dispensing Adhesive Bonding Screw Tighten Equipment

IGBT frame turntable automatic assembly line, including automatic loading and unloading, dispensing, AOI, automatic screw tighten and other functions.
IGBT Bottom Plate+DBC Automatic Feeding and Bonding Line

IGBT Bottom Plate+DBC Automatic Feeding and Bonding Equipment
Semiconductor Potting & Curing Production Line

Hols provides critical curing production lines for electronic semiconductor products, including: IGBT potting, brake potting, sensor potting, OBC potting, ECU potting, camera module potting,etc.
PCBA Encapsulation & Testing Production Line

Lights-out PCBA assembly & test line: 25s cycle, zero operators, ≥98% yield, ≥85% OEE. Covers loading, press-fit, PIN inspection, dispensing, curing, FCT, programming, vision, laser marking & unloading.

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