
Hols Automation provides a full lineup of industrial curing equipment, covering multi-layer curing ovens, stacked curing systems, high-temperature tunnel furnaces and cleanroom-grade tunnel curing ovens. These thermal processing machines are purpose-built for glue heating, preheating, drying, baking, post-dispensing curing and vacuum potting solidification procedures, perfectly matching automated dispensing lines, vacuum potting machines and dynamic mixing dispensing systems for automotive electronics, new energy and power semiconductor manufacturing.
Designed for post-potting curing of PCB, ECU, BMS, power modules, flat wire motor stator coatings and battery encapsulation components, this multi-layer curing oven delivers stable, consistent thermal curing for single-component and two-component AB epoxy, silicone and polyurethane adhesives. It can be integrated with automated dispensing units, vacuum glue supply systems and in-line vacuum potting equipment to form a complete dispensing & curing production workflow, ideal for mass manufacturing of lithium batteries, EV electronics and sensor assemblies.
| High temperature clean oven FO (C) series | ||||||
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Equipment model |
FO(C)-2 |
FO(C)-3 |
FO(C)-4 |
FO(C)-5 |
FO(C)-2D |
FO(C)-3D |
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Temperature Control Range |
40~250℃ (can be customized Max. 500 ℃ ) |
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Temperature resolution |
0.1℃ |
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Temperature fluctuation |
±1℃(Same collection point) |
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Temperature uniformity |
±2.5%(200 ℃ constant temperature no-load test data) |
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○Cleanliness (optional) |
○ class 1000 |
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